4oz Multilayer FR4 PCB Board in ENIG used in Energy Industry with IPC Class 3

Short Description:

  • Model NO.: PCB-A9
  • Layer: 8L
  • Dimension: 113*75mm
  • Base Material: FR4
  • Board Thickness: 1.5mm
  • Surface Funish: ENIG 2u''
  • Copper Thickness: 4.0oz
  • Solder mask color: Blue
  • Legend color: White
  • Special Technology: Gold Finger and filling epoxy and capping with copper
  • Definitions: IPC Class3
  • Product Detail

    Product Tags

    Manufacturing info

    Model No. PCB-A9
    Transport package Vacuum Packing
    Certification UL,ISO9001&ISO14001,RoHS
    Application Consumer electronics
    Minimum Space/Line 0.075mm/3mil
    Production Capacity 50,000 s.q.m/month
    HS Code 853400900
    Origin Made in China

    Product Description

    FR4 PCB Introduction

    FR means “flame-retardant,” FR-4 (or FR4) is a NEMA grade designation for glass-reinforced epoxy laminate material, a composite material composed of woven fiberglass cloth with an epoxy resin binder that makes it an ideal substrate for electronic components on a printed circuit board.

    FR4 PCB Introduction

    Pros and Cons of FR4 PCB

    FR-4 material is so popular because of its many wondrous qualities that can benefit printed circuit boards. In addition to being affordable and easy to work with, it is an electrical insulator with very high dielectric strength. Plus, it's durable, moisture-resistant, temperature-resistant and lightweight.

    FR-4 is a widely relevant material, popular mostly for its low cost and relative mechanical and electrical stability. While this material features extensive benefits and is available in a variety of thicknesses and sizes, it isn't the best choice for every application, especially high-frequency applications like RF and microwave designs.

    Multi-layer PCB Structure

    Multilayer PCBs further increases the complexity and density of PCB designs by adding additional layers beyond the top and bottom layers seen in double sided boards. Multilayer PCBs are built by laminating the various layers. The inner-layers, normally double-sided circuit boards, are stacked together, with insulating layers in between and between the copper-foil for the outer-layers. Holes drilled through the board (vias) will make connections with the different layers of the board.

    Technical & Capability

    Technical & Capability

    Item Production Capacity
    Layer Counts 1-20 layers
    Material FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc
    Board thickness 0.10mm-8.00mm
    Maximum Size 600mmX1200mm
    Board Outline Tolerance +0.10mm
    Thickness Tolerance(t≥0.8mm) ±8%
    Thickness Tolerance(t<0.8mm) ±10%
    Insulation Layer Thickness 0.075mm--5.00mm
    Minimum Line 0.075mm
    Minimum Space 0.075mm
    Out Layer Copper Thickness 18um--350um
    Inner Layer Copper Thickness 17um--175um
    Drilling Hole(Mechanical) 0.15mm--6.35mm
    Finish Hole(Mechanical) 0.10mm-6.30mm
    Diameter Tolerance(Mechanical) 0.05mm
    Registration(Mechanical) 0.075mm
    Aspect Ratio 16:1
    Solder Mask Type LPI
    SMT Mini.Solder Mask Width 0.075mm
    Mini. Solder Mask Clearance 0.05mm
    Plug Hole Diameter 0.25mm--0.60mm
    Impedance control Tolerance ±10%
    Surface finish/treatment HASL, ENIG, Chem, Tin, Flash Gold, OSP, Gold Finger

    Q/T Lead Time

    Category Quickest Lead Time Normal Lead Time
    Double-sided 24hrs 120hrs
    4 Layers 48hrs 172hrs
    6 Layers 72hrs 192hrs
    8 Layers 96hrs 212hrs
    10 Layers 120hrs 268hrs
    12 Layers 120hrs 280hrs
    14 Layers 144hrs 292hrs
    16-20 Layers Depends on the specific requirements
    Above 20 Layers Depends on the specific requirements

    ABIS' move to control FR4 PCBS

    Hole Preparation

    Removing debris carefully & adjusting drill machine parameters: before plating through with copper, ABIS pays high attention to all holes on an FR4 PCB treated to remove debris, surface irregularities, and epoxy smear, the clean holes ensure the plating successfully adheres to the hole walls. also, early in the process, drill machine parameters are adjusted accurately.

    Surface Preparation

    Deburring carefully: our experienced tech workers will be aware ahead of time that the only way to avoid a bad outcome is to anticipate the need for special handling and to take the appropriate steps to be sure that the process is done carefully and correctly.

    Thermal Expansion Rates

    Accustomed to dealing with the various materials, ABIS will be able to analyze the combination to be sure that it is appropriate. then keeping the long-term reliability of the CTE (coefficient of thermal expansion), with the lower CTE, the less likely the plated through holes are to fail from repeated flexing of the copper which forms the internal layer interconnections.


    ABIS control the circuitry is scaled-up by known percentages in anticipation of this loss so that the layers will return to their as-designed dimensions after the lamination cycle is complete. also, using the laminate manufacturer’s baseline scaling recommendations in combination with in-house statistical process control data, to dial-in scale factors that will be consistent over time within that particular manufacturing environment.


    When the time comes to build your PCB, ABIS be sure that you choose has the right equipment and experience to produce it correctly on the first try.

    PCB Product&Equipment Show

    Rigid PCB, Flexible PCB, Rigid-Flex PCB, HDI PCB, PCB Assembly

    Rigid PCB, Flexible PCB, Rigid-Flex PCB, HDI PCB, PCB Assembly-1
    PCB equipment-1

    ABIS Quality Mission

    Advanced equipment LIST

    AOI Testing Checks for solder pasteChecks for components down to 0201

    Checks for missing components, offset, incorrect parts, polarity

    X-Ray Inspection X-Ray provides high-resolution inspection of:BGAs/Micro BGAs/Chip scale packages /Bare boards
    In-Circuit Testing In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.
    Power-up Test Advanced Function TestFlash Device Programming

    Functional testing

    IOC incoming inspection

    SPI solder paste inspection

    Online AOI inspection

    SMT first article inspection

    External assessment

    X-RAY-welding inspection

    BGA device rework

    QA inspection

    Anti-static warehousing and shipment

    Pursue 0% complaint on quality

    All department implements according to ISO and the related dept has to provide 8D report if any board scrapped to defective.

    All the outgoing boards have to be 100% electronic tested, impedance tested and soldering.

    Visual inspected, we make the inspect microsection before shipment.

    Train the mindset of employees and our enterprise culture, make they happy with their work and our company, it's helpful for them to produce good quality products.

    High quality raw material (Shengyi FR4, ITEQ, Taiyo Solder Mask Ink etc.)

    The AOI could inspect the whole set, boards are inspected after each process

    China Multilayer PCB Board 6layers ENIG Printed Circult Board with Filled Vias in IPC Class 3-22
    Quality Workshop


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    1.How to get a accurate quote from ABIS?

    To ensure an accurate quote, be sure to include the following information for your project:

    Complete GERBER files including the BOM list

    l Quantities

    l Turn time

    l Panelization Requirements

    l Materials Requirements

    l Finish requirements

    l Your custom quote will be delivered in just 2-24 hours, depending on the design complexity.

    2.How can we know the processing of PCB orders?

    Each Customer will have a sale to contact you. Our working hours: AM 9:00-PM 19:00(Beijing Time) from Monday to Friday. We will reply to your email as soon as quickly during our working time. And you also could contact our sales by cellphone if urgent.

    3.What certifications do you have?

    ISO9001, ISO14001,UL USA& USA Canada,IFA16949, SGS, RoHS report.

    4.How do you test and control the quality?

    Our Quality Assuring Procedures as below:

    a),Visual Inspection

    b),Flying probe, fixture tool

    c), Impedance control

    d), Solder-ability detection

    e), Digital metallo graghic microscope

    f),AOI (Automated Optical Inspection)

    5.Can I have samples to test?

    Yes, we are pleased to supply module samples to test and check the quality, mixed sample order is available. Please note buyer should pay for the shipping cost.

    6.How about your Quick Turn Service?

    On time delivery rate is more than 95%

    a),24 hours fast turn for double side prototype PCB

    b),48hours for 4-8 layers prototype PCB

    c),1 hour for quotation

    d),2 hours for engineer question/Complaint feedback

    e),7-24 hours for technical support/order service/manufacturing operations

    7.I am a small wholesaler, do you accept small orders?

    ABIS never choose orders. Both Small orders and Mass orders are welcome and We ABIS will be seriously and responsible, and serve customers with quality and quantity.

    8.What kinds of testing do you have?

    ABlS performs 100% visual and AOl inspection as well as performing electrical testing, high voltage testing, impedance control testing, micro-sectioning, thermal shock testing, solder testing, reliability testing, insulating resistance testing, ionic cleanliness testing and PCBA Functional testing.

    9.Pre-Sale and After-Sale Service?

    a),1 Hour quotation

    b),2 hours of complaint feedback

    c),7*24 hour technical support

    d),7*24 order service

    e),7*24 hour delivery

    f),7*24 production run

    10.What are the Production capacity of hot-sale products?

    Production capacity of hot-sale products

    Double Side/Multilayer PCB Workshop

    Aluminum PCB Workshop

    Technical Capability

    Technical Capability

    Raw materials: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON

    Raw materials: Aluminum base, Copper base

    Layer: 1 layer to 20 Layers

    Layer: 1 layer and 2 Layers

    Min.line width/space: 3mil/3mil(0.075mm/0.075mm)

    Min.line width/space: 4mil/4mil(0.1mm/0.1mm)

    Min.Hole size: 0.1mm(dirilling hole)

    Min. Hole size: 12mil(0.3mm)

    Max. Board size: 1200mm* 600mm

    Max.Board size: 1200mm* 560mm(47in* 22in)

    Finished board thickness: 0.2mm- 6.0mm

    Finished board thickness: 0.3~ 5mm

    Copper foil thickness: 18um~280um(0.5oz~8oz)

    Copper foil thickness: 35um~210um(1oz~6oz)

    NPTH Hole Tolerance: +/-0.075mm, PTH hole Tolerance: +/-0.05mm

    Hole position tolerance: +/-0.05mm

    Outline Tolerance: +/-0.13mm

    Routing outline tolerance: +/ 0.15mm; punching outline tolerance:+/ 0.1mm

    Surface finished: Lead-free HASL, immersion gold(ENIG), immersion silver, OSP, gold plating, gold finger, Carbon INK.

    Surface finished: Lead free HASL, immersion gold(ENIG), immersion silver, OSP etc

    Impedance control tolerance: +/-10%

    Remain thickness tolerance: +/-0.1mm

    Production capability: 50,000 s.q.m/month

    MC PCB Production capability: 10,000 s.q.m/month

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