6 layers Hard Gold PCB Board with 3.2mm board thickness and Counter Sink Hole

Short Description:

Basic Info Model No. PCB-A38, Crafted specifically for the demanding PCB industry, this exceptional product showcases our expertise in manufacturing excellence. With state-of-the-art factory production and stringent quality control measures, we ensure unparalleled precision and reliability. Versatile in application, this PCB board caters to a wide range of industries, including telecommunications, aerospace, automotive, and medical devices.

  • Model NO.: PCB-A38
  • Layer: 6L
  • Dimension: 120*63mm
  • Base Material: FR4
  • Board Thickness: 3.2mm
  • Surface Funish: ENIG
  • Copper Thickness: 2.0oz
  • Solder mask color: Green
  • Legend color: White
  • Definitions: IPC Class2
  • Product Detail

    Product Tags

    Basic Info

    Model No. PCB-A37
    Transport package Vacuum Packing
    Certification UL,ISO9001&ISO14001,RoHS
    Application Consumer electronics
    Minimum Space/Line 0.075mm/3mil
    Production Capacity 50,000 s.q.m/month
    HS Code 853400900
    Origin Made in China

    Product Description

    HDI PCB Introduction

    HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB. They have much finer lines and spaces, smaller vias and capture pads, and higher connection pad density than employed in conventional PCB technology. HDI PCBs are made through microvias, buried vias and sequential lamination with insulation materials and conductor wiring for higher density of routing.

    FR4 PCB Introduction


    HDI PCB is used to reduce size and weight, as well as to enhance electrical performance of the device. HDI PCB is the best alternative to high layer-count and expensive standard laminate or sequentially laminated boards. HDI incorporate blind and buried vias that help to save PCB real estate by allowing features and lines to be designed above or below them without making a connection. Many of today's fine pitch BGA and flip-chip component footprints do not allow for running traces between the BGA pads. Blind and buried vias will only connect layers requiring connections in that area.

    Technical & Capability

    Layers 1-20L Thicker Copper 1-6OZ
    Products Type HF(High-frequency) &(Radio Frequency)board, Imedance controlled board, HDIboard, BGA & Fine Pitch board Solder Mask Nanya & Taiyo; LRI & Matt Red. green,yellow, white, blue, black
    Base material FR4(Shengyi China,ITEQ, KB A+,HZ),HITG,FrO6,Rogers,Taconic,Argon,Nalco lsola and so on Finished Surface Conventional HASL,Lead-free HASL,FlashGold,ENIG (lmmersion Gold) OSP (Entek),lmmersion TiN, lmmersion Silver,Hard Gold
    Selective Surface treatment ENIG(immersion Gold) + OSP ,ENIG(immersion Gold) + Gold Finger, Flash Gold Finger, immersionSlive + Gold Finger, Immersion Tin + Gold Finger
    Technical Specification Minimum line width/gap: 3.5/4mil (laser dril)
    Minimum hole size: 0.15 mm(mechanical drill/4 mill laser drill)
    Minimum Annular Ring: 4mil
    Max Copper thickness: 6Oz
    Max Production size: 600x1200mm
    Board Thickness: D/S: 0.2-70mm,Mulltilayers: 0.40-7.Omm
    Min Solder Mask Bridge: ≥0.08mm
    Aspect ratio: 15:1
    Plugging vias capability: 0.2-0.8mm
    Tolerance Plated holes Tolerance : ±0.08mm(min±0.05)
    Non-plated hole tolerance: ±O.05min(min+O/-005mm or +0.05/Omm)
    Outline Tolerance: ±0.15min(min±0.10mm)
    Functional test:
    lnsulating resistance: 50 ohms (normality)
    Peel off strength: 14N/mm
    Thermal Stress test: 265C.20 seconds
    Solder mask hardness: 6H
    E-test voltage: 50ov±15/-0V 3os
    Warp and Twist: 0.7%( semiconductor test board 0.3%)
    Double Side or Multilayer board

    Features-Our Products Advantage

    Morethan 15 years experience manufacturer in PCB service field

    Big scale of producing makes sure that your purchase cost is lower.

    Advanced production line guarantees stable quality and long life span

    100% test for all customized PCB products

    One-stop Service ,we can help to purchase the components

    PCB equipment-1

    Q/T Lead Time

    Category Quickest Lead Time Normal Lead Time
    Double-sided 24hrs 120hrs
    4 Layers 48hrs 172hrs
    6 Layers 72hrs 192hrs
    8 Layers 96hrs 212hrs
    10 Layers 120hrs 268hrs
    12 Layers 120hrs 280hrs
    14 Layers 144hrs 292hrs
    16-20 Layers Depends on the specific requirements
    Above 20 Layers Depends on the specific requirements

    ABIS' move to control FR4 PCBS

    Hole Preparation

    Removing debris carefully & adjusting drill machine parameters: before plating through with copper, ABIS pays high attention to all holes on an FR4 PCB treated to remove debris, surface irregularities, and epoxy smear, the clean holes ensure the plating successfully adheres to the hole walls. also, early in the process, drill machine parameters are adjusted accurately.

    Surface Preparation

    Deburring carefully: our experienced tech workers will be aware ahead of time that the only way to avoid a bad outcome is to anticipate the need for special handling and to take the appropriate steps to be sure that the process is done carefully and correctly.

    Thermal Expansion Rates

    Accustomed to dealing with the various materials, ABIS will be able to analyze the combination to be sure that it is appropriate. then keeping the long-term reliability of the CTE (coefficient of thermal expansion), with the lower CTE, the less likely the plated through holes are to fail from repeated flexing of the copper which forms the internal layer interconnections.


    ABIS control the circuitry is scaled-up by known percentages in anticipation of this loss so that the layers will return to their as-designed dimensions after the lamination cycle is complete. also, using the laminate manufacturer’s baseline scaling recommendations in combination with in-house statistical process control data, to dial-in scale factors that will be consistent over time within that particular manufacturing environment.


    When the time comes to build your PCB, ABIS be sure that you choose has the right equipment and experience to produce it

    ABIS Quality Mission

    The pass rate of incoming material above 99.9%, the number of mass rejection rates below 0.01%.

    ABIS certified facilities control all key processes to eliminate all potential issues before producing.

    ABIS utilizes advanced software to perform extensive DFM analysis on incoming data, and uses advanced quality control systems throughout the manufacturing process.

    ABIS performs 100% visual and AOI inspection as well as performing electrical testing, high voltage testing, impedance control testing, micro-sectioning, thermal shock testing, solder testing, reliability testing, insulating resistance testing and ionic cleanliness testing.

    China Multilayer PCB Board 6layers ENIG Printed Circult Board with Filled Vias in IPC Class 3-22


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    1.Where does the resin material come from in ABIS?

    Most of them from Shengyi Technology Co., Ltd. (SYTECH), who has been the world's second largest CCL manufacturer in terms of sales volume, from 2013 to 2017. We established long-term relations of cooperation since 2006. The FR4 resin material (Model S1000-2, S1141, S1165, S1600) are mainly used for making single and double-sided printed circuit boards as well as multi-layer boards. Here comes details for your reference.

    For FR-4: Sheng Yi, King Board, Nan Ya, Polycard, ITEQ, ISOLA

    For CEM-1 & CEM 3: Sheng Yi, King Board

    For High Frequency : Sheng Yi

    For UV Cure:  Tamura, Chang Xing ( * Available colour : Green) Solder for Single Side

    For Liquid Photo: Tao Yang, Resist (Wet Film)

    Chuan Yu ( * Available colors : White, Imaginable Solder Yellow, Purple, Red, Blue, Green,  Black)

    2.Pre-Sale and After-Sale Service?

    ),1 Hour quotation

    b),2 hours of complaint feedback

    c),7*24 hour technical support

    d),7*24 order service

    e),7*24 hour delivery

    f),7*24 production run

    3.Can you manufacture my PCBs from a picture file?

    No, we can't accept picture files, if you no not have Gerber file, can you send us sample to copy it.

    PCB&PCBA Copy Process:

    Can you manufacture my PCBs from a picture file

    4.How do you test and control the quality?

    Our Quality Assuring Procedures as below:

    a),Visual Inspection

    b),Flying probe, fixture tool

    c), Impedance control

    d), Solder-ability detection

    e), Digital metallo graghic microscope

    f),AOI (Automated Optical Inspection)

    5.What is your production process?

    What is your production process01

    6.How about your Quick Turn Service?

    On time delivery rate is more than 95%

    a),24 hours fast turn for double side prototype PCB

    b),48hours for 4-8 layers prototype PCB

    c),1 hour for quotation

    d),2 hours for engineer question/Complaint feedback

    e),7-24 hours for technical support/order service/manufacturing operations

    7.Do you have MOQ of products? If yes, what is the minimum quantity?

    ABIS has no MOQ requirements for either PCB or PCBA.

    8.What kinds of testing do you have?

    ABlS performs 100% visual and AOl inspection as well as performing electrical testing, high voltage testing, impedance control testing, micro-sectioning, thermal shock testing, solder testing, reliability testing, insulating resistance testing, ionic cleanliness testing and PCBA Functional testing.

    9.Which regions does your market mainly cover?

    ABIS's Main Industries: Industrial Control, Telecommunication, Automotive Products and Medical.                                                                                                                                                                             ABIS's Main Market: 90% International Market(40%-50% for USA, 35% for Europe, 5% for Russia and 5%-10% for East Asia) and 10% Domestic Market.

    10.What are the Production capacity of hot-sale products?
    Production capacity of hot-sale products
    Double Side/Multilayer PCB Workshop Aluminum PCB Workshop
    Technical Capability Technical Capability
    Raw materials: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON Raw materials: Aluminum base, Copper base
    Layer: 1 layer to 20 Layers Layer: 1 layer and 2 Layers
    Min.line width/space: 3mil/3mil(0.075mm/0.075mm) Min.line width/space: 4mil/4mil(0.1mm/0.1mm)
    Min.Hole size: 0.1mm(dirilling hole) Min. Hole size: 12mil(0.3mm)
    Max. Board size: 1200mm* 600mm Max.Board size: 1200mm* 560mm(47in* 22in)
    Finished board thickness: 0.2mm- 6.0mm Finished board thickness: 0.3~ 5mm
    Copper foil thickness: 18um~280um(0.5oz~8oz) Copper foil thickness: 35um~210um(1oz~6oz)
    NPTH Hole Tolerance: +/-0.075mm, PTH hole Tolerance: +/-0.05mm Hole position tolerance: +/-0.05mm
    Outline Tolerance: +/-0.13mm Routing outline tolerance: +/ 0.15mm; punching outline tolerance:+/ 0.1mm
    Surface finished: Lead-free HASL, immersion gold(ENIG), immersion silver, OSP, gold plating, gold finger, Carbon INK. Surface finished: Lead free HASL, immersion gold(ENIG), immersion silver, OSP etc
    Impedance control tolerance: +/-10% Remain thickness tolerance: +/-0.1mm
    Production capability: 50,000 s.q.m/month MC PCB Production capability: 10,000 s.q.m/month

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