4 Layers 2.0mm thickness and1oz Copper Green Mask Printed Circuit Assembly Board
Manufacturing info
| Model No. | PCB-A41 |
| Transport package | Vacuum Packing |
| Certification | UL,ISO9001&ISO14001,RoHS |
| Definitions | IPC Class2 |
| Minimum Space/Line | 0.075mm/3mil |
| Origin | Made in China |
| Production Capacity | 720,000 M2/Year |
| Application | Consumer Electronics |
Product Description
PCBA Projects Introduction
ABIS CIRCUITS Company deliver services, not only products. We offer solutions, not only goods.
From the PCB production, the components purchasing to the components assemble. Includes:
PCB Custom
PCB drawing / design according to your schematic diagram
PCB manufacturing
Component sourcing
PCB Assemble
PCBA 100% test
Our Advantages
High-end equipment-high speed Pick and Place Machines that can process about 25,000 SMD components per hour
High efficient supply ability 60K Sqm monthly-Offers low volume and on-demand PCB production, also large-scale productions
Professional engineering team-40 engineers and their own tooling house, strong at OEM. Offers two easy options: Custom and Standard-In-depth knowledge of IPC Class II and III Standards
We provide a comprehensive turn-key EMS service to customers who want us to assemble the PCB into PCBA, including prototypes, NPI project, small and medium volume. We are also able to source all components for your PCB assembly project. Our engineers and sourcing team have rich experience in supply chain and EMS industry, with deep knowledges in SMT assembly allowing to resolve all the production issues. Our service is cost-effective, flexible, and reliable. We have satisfied customers across many industries including medical, industrial, automotive and consumer electronics.
PCBA Capabilities
| 1 | SMT assembly including BGA assembly |
| 2 | Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP |
| 3 | Component height: 0.2-25mm |
| 4 | Min packing: 0204 |
| 5 | Min distance among BGA : 0.25-2.0mm |
| 6 | Min BGA size: 0.1-0.63mm |
| 7 | Min QFP space: 0.35mm |
| 8 | Min assembly size: (X*Y): 50*30mm |
| 9 | Max assembly size: (X*Y): 350*550mm |
| 10 | Pick-placement precision: ±0.01mm |
| 11 | Placement capability: 0805, 0603, 0402 |
| 12 | High pin count press fit available |
| 13 | SMT capacity per day: 80,000 points |
Capability - SMT
|
Lines |
9(5 Yamaha,4KME) |
|
Capacity |
52 million placements per month |
|
Max Board Size |
457*356mm.(18”X14”) |
|
Min Component size |
0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFP |
|
Speed |
0.15 sec/chip,0.7 sec/QFP |
Capability - PTH
|
Lines |
2 |
|
Max board width |
400 mm |
|
Type |
Dual wave |
|
Pbs status |
Lead-free line support |
|
Max temp |
399 degree C |
|
Spray flux |
add-on |
|
Pre-heat |
3 |
Production Processes
Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping
Quality Control
| AOI Testing | Checks for solder paste
Checks for components down to 0201 Checks for missing components, offset, incorrect parts, polarity |
| X-Ray Inspection | X-Ray provides high-resolution inspection of:
BGAs/Micro BGAs/Chip scale packages /Bare boards |
| In-Circuit Testing | In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems. |
| Power-up Test | Advanced Function Test
Flash Device Programming Functional testing |
Certificate
FAQ
| Category | Quickest Lead Time | Normal Lead Time |
| Double-sided | 24hrs | 120hrs |
| 4 Layers | 48hrs | 172hrs |
| 6 Layers | 72hrs | 192hrs |
| 8 Layers | 96hrs | 212hrs |
| 10 Layers | 120hrs | 268hrs |
| 12 Layers | 120hrs | 280hrs |
| 14 Layers | 144hrs | 292hrs |
| 16-20 Layers | Depends on the specific requirements | |
| Above 20 Layers | Depends on the specific requirements | |
Bill of materials (BOM) detailing:
a), Manufacturers parts numbers,
b), Components suppliers' parts number (e.g. Digi-key, Mouser, RS )
c), PCBA sample photos if possible.
d), Quantity
| Production capacity of hot-sale products | |
| Double Side/Multilayer PCB Workshop | Aluminum PCB Workshop |
| Technical Capability | Technical Capability |
| Raw materials: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Raw materials: Aluminum base, Copper base |
| Layer: 1 layer to 20 Layers | Layer: 1 layer and 2 Layers |
| Min.line width/space: 3mil/3mil(0.075mm/0.075mm) | Min.line width/space: 4mil/4mil(0.1mm/0.1mm) |
| Min.Hole size: 0.1mm(dirilling hole) | Min. Hole size: 12mil(0.3mm) |
| Max. Board size: 1200mm* 600mm | Max.Board size: 1200mm* 560mm(47in* 22in) |
| Finished board thickness: 0.2mm- 6.0mm | Finished board thickness: 0.3~ 5mm |
| Copper foil thickness: 18um~280um(0.5oz~8oz) | Copper foil thickness: 35um~210um(1oz~6oz) |
| NPTH Hole Tolerance: +/-0.075mm, PTH hole Tolerance: +/-0.05mm | Hole position tolerance: +/-0.05mm |
| Outline Tolerance: +/-0.13mm | Routing outline tolerance: +/ 0.15mm; punching outline tolerance:+/ 0.1mm |
| Surface finished: Lead-free HASL, immersion gold(ENIG), immersion silver, OSP, gold plating, gold finger, Carbon INK. | Surface finished: Lead free HASL, immersion gold(ENIG), immersion silver, OSP etc |
| Impedance control tolerance: +/-10% | Remain thickness tolerance: +/-0.1mm |
| Production capability: 50,000 s.q.m/month | MC PCB Production capability: 10,000 s.q.m/month |
No, we can't accept picture files, if you no not have Gerber file, can you send us sample to copy it.
PCB&PCBA Copy Process:
Our Quality Assuring Procedures as below:
a),Visual Inspection
b),Flying probe, fixture tool
c), Impedance control
d), Solder-ability detection
e), Digital metallograghic microscope
f),AOI (Automated Optical Inspection)
ABlS performs 100% visual and AOl inspection as well as performing electrical testing, high voltage testing, impedance control testing, micro-sectioning, thermal shock testing, solder testing, reliability testing, insulating resistance testing, ionic cleanliness testing and PCBA Functional testing.
ABIS's Main Industries: Industrial Control, Telecommunication, Automotive Products and Medical. ABIS's Main Market: 90% International Market(40%-50% for USA, 35% for Europe, 5% for Russia and 5%-10% for East Asia) and 10% Domestic Market.
On time delivery rate is more than 95%
a),24 hours fast turn for double side prototype PCB
b),48hours for 4-8 layers prototype PCB
c),1 hour for quotation
d),2 hours for engineer question/Complaint feedback
e),7-24 hours for technical support/order service/manufacturing operations
·With ABIS, customers significantly and effectively reduce their global procurement costs. Behind each service provided by ABIS, is hidden a cost-saving for customers.
. We have two shops together, one is for prototype, quick turn, and small volume making. The other is for mass production also for the HDI board, with highly skilled professional employees, for high-quality products with competitive prices and on-time delivery.
. We provide very professional sales, technical and logistic support, on a worldwide basis with 24 hours of complaint feedback.
