Customized High-Quality PCB Assembly for Smart Energy Measurement Devices

Short Description:

Basic Info Model No. PCB-A56, a 4layer circular board featuring a stylish black oil finish and crisp white lettering. Designed for excellence, this compact 79*79mm board comes equipped with components expertly attached on both sides, ensuring top-tier functionality for smart energy measurement devices.

The four-layer design not only enhances performance but also allows for increased complexity in circuitry, enabling more advanced features. The black oil coating adds a touch of sophistication while providing durability and resistance against environmental factors.

We pride ourselves on delivering products of exceptional quality, and PCB-A56 is no exception. Its meticulous design and reliable manufacturing make it a standout choice for those seeking a high-quality solution for smart energy applications. Elevate your devices with PCB-A56 — where innovation, style, and performance converge seamlessly.


  • Model NO.: PCBA-A56
  • Layer: 4L
  • Dimension: 79*79mm
  • Base Material: FR4
  • Board Thickness: 1.5mm
  • Surface Funish: HASL
  • Copper Thickness: 1.0oz
  • Solder mask color: Black
  • Legend color: White
  • Definitions: IPC Class2
  • Product Detail

    Product Tags

    Basic Info

    Model No. PCBA-A56
    Assembly method Post Welding
    Transport package Anti-static Packaging
    Certification UL, ISO9001&14001, SGS, RoHS, Ts16949
    Definitions IPC Class2
    Minimum Space/Line 0.075mm/3mil
    Application Signal transmission
    Origin Made in China
    Production Capacity 720,000 M2/Year

    PCBA Projects Introduction
    ABIS CIRCUITS Company deliver services, not only products. We offer solutions, not only goods.

    From the PCB production, the components purchasing to the components assemble. Includes:

    PCB Custom

    PCB drawing / design according to your schematic diagram

    PCB manufacturing

    Component sourcing

    PCB Assemble

    PCBA 100% test

    Product Description

    PCB equipment-1
    PCBA Facilities

    Production Processes
    Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping

    PCBA Capabilities

    1 SMT assembly including BGA assembly
    2 Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP
    3 Component height: 0.2-25mm
    4 Min packing: 0201
    5 Min distance among BGA : 0.25-2.0mm
    6 Min BGA size: 0.1-0.63mm
    7 Min QFP space: 0.35mm
    8 Min assembly size: (X*Y): 50*30mm
    9 Max assembly size: (X*Y): 350*550mm
    10 Pick-placement precision: ±0.01mm
    11 Placement capability: 0805, 0603, 0402
    12 High pin count press fit available
    13 SMT capacity per day: 80,000 points

    Capability - SMT

    Lines

     9(5 Yamaha,4KME)

    Capacity

    52 million placements per month

    Max Board Size

    457*356mm.(18”X14”)

    Min Component size

    0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFP

    Speed

    0.15 sec/chip,0.7 sec/QFP

    Capability - PTH

    Lines

    2

    Max board width

    400 mm

    Type

    Dual wave

    Pbs status

    Lead-free line support

    Max temp

    399 degree C

    Spray flux

    add-on

    Pre-heat

    3

    Q/T Lead Time

    Category Quickest Lead Time Normal Lead Time
    Double-sided 24hrs 120hrs
    4 Layers 48hrs 172hrs
    6 Layers 72hrs 192hrs
    8 Layers 96hrs 212hrs
    10 Layers 120hrs 268hrs
    12 Layers 120hrs 280hrs
    14 Layers 144hrs 292hrs
    16-20 Layers Depends on the specific requirements
    Above 20 Layers Depends on the specific requirements

    Quality Control

    ABIS Quality Mission
    AOI Testing Checks for solder pasteChecks for components down to 0201 

    Checks for missing components, offset, incorrect parts, polarity

    X-Ray Inspection X-Ray provides high-resolution inspection of:BGAs/Micro BGAs/Chip scale packages /Bare boards
    In-Circuit Testing In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.
    Power-up Test Advanced Function TestFlash Device Programming 

    Functional testing

    • IOC incoming inspection
    • SPI solder paste inspection
    • Online AOI inspection
    • SMT first article inspection
    • External assessment
    • X-RAY-welding inspection
    • BGA device rework
    • QA inspection
    • Anti-static warehousing and shipment

    FAQ

    Q1: What do you require in order to produce an assembly quotation?

    A: 

    Bill of materials (BOM) detailing:

    a), Manufacturers parts numbers,

    b), Components suppliers' parts number (e.g. Digi-key, Mouser, RS )

    c), PCBA sample photos if possible.

    d), Quantity

    Q2: Can you provide free samples for me?

    A: Free samples depend on your order quantity.

    Q3: Can you manufacture my PCBs from a picture file?

    A: 

    No, we can't accpet picture files, if you no not have gerber file, can you send us sample to copy it.

    PCB&PCBA Copy Process